Blind/Buried via 8 Layers Prototype PCB Hole in PAD
Blind/Buried via 8 Layers Prototype PCB Hole in PAD
Blind/Buried via 8 Layers Prototype PCB Hole in PAD
Blind/Buried via 8 Layers Prototype PCB Hole in PAD
Blind/Buried via 8 Layers Prototype PCB Hole in PAD
Blind/Buried via 8 Layers Prototype PCB Hole in PAD
Blind/Buried via 8 Layers Prototype PCB Hole in PAD
Blind/Buried via 8 Layers Prototype PCB Hole in PAD

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Blind/Buried via 8 Layers Prototype PCB Hole in PAD

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Model No. :
Brand Name : BentePCB
Type : Rigid Circuit Board
Flame Retardant Properties : V0
Dielectric : FR-4
Base Material : Copper
Insulation Materials : Organic Resin
Processing Technology : Electrolytic Foil
Application : Aerospace
Mechanical Rigid : Rigid
Material : FR4,Tg170
Brand : JC
Finished Copper : 1oz
Layers : 8 Layers
Min.Line Width/Space : 3/3mil
Surface Treatment : ENIG 5u"
Minimum Hole : 0.25mm
Thickness : 1.6mm±10%
Technical Features : Blind/Buried Via, 4 BGA/pcs, Hole In PAD, Thick Go
Applications : Automation Equipment
более
7yrs

Shenzhen, Guangdong, China

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Product Description:

8 Layers Prototype PCB, 4 BGA per PCS and Hole in PAD,Blind/Buried via, ENIG 5u" Thickness Gold.Mainly use in Automation Equipment. We recommend you chose PCB prototyping service for function testing of new products prior to making a commitment to a full-production run. 
Our PCB products are mainly used in these fields: Power Electronics, Communications, Industrial Control, Medical Electronics, Security Electronics, Consumer Electronics, Computer, Automotive Electronics, etc.
Good News: Every orders will get free SMT stencil , please check out our website at www.bentepcb.com/onlinepcb.htm


HDI PCB:

High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).

HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.

They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.

Andwin maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.

Stack up of HDI PCB

Stack up of 1  Step HDI PCB

Stack up of 1 Step HDI PCB

Stack up of 2 step HDI PCB

Stack up of 2 step HDI PCB

Stack up of  2 steps HDI with blind via and buried via

 Stack up of 2 steps HDI with blind via and buried via

Anylayer connect of HDI PCB, need to adjust drill

Anylayer connect of HDI PCB, need to adjust drill


About Us:

BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB, rigid PCB and flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volume.

Why Us?

UL (E492586), ISO9001,  ISO14001, TS16949, RoHS certified.
Turnover USD 
10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to 
16 layers.
Special Material:
ROGERS, Arlon, Taconic.etc.
Client:
Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.


Certification(UL:E492586, TS16949, ISO14001, ISO9001,RoHS):

ISO9001,ISO14001UL:E492586

Factory Tour:

PCB Manufacturer

PCB Factory

PCB Manufacturing

Exhibition:

We Took part in the famous exhibitions over the past years,and got highly appreciation from the top experts,as well as cooperated tightly with them.

Exhibition

Delivery:

BentePCB offers flexible shipping methods for our customers, you may choose from one of the methods below.
Delivery

PCB China

We don`t just sell PCBs .We sell sleep.

Contact Us

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